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XENON S-5100

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Xeon® Processor 5100

 

The Dual-Core Intel® Xeon® Processor 5100 Series are 64-bit server/workstation processors utilizing two Intel microarchitecture cores.

These processors are based on Intel’s 65 nanometer process technology combining high performance with the power efficiencies of a low-power microarchitecture.

The Dual-Core Intel® Xeon® Processor 5100 Series maintain the tradition of compatibility with IA-32 software.

Some key features include on-die, 32 KB Level 1 instruction and data caches and 4 MB Level 2 cache with Advanced Transfer Cache Architecture.

The processors’ Data Prefetch Logic speculatively fetches data to the L2 cache before an L1 cache requests occurs, resulting in reduced bus cycle penalties and improved performance.

The 1333 MHz Front Side Bus (FSB) is a quad-pumped bus running off a 333 MHz system clock making 10.66 GBytes per second data transfer rates possible.

Some lower speed SKU’s are available which support a 1066 MHz Front Side Bus (FSB).

This is a quad-pumped bus running off a 266 MHz system clock making 8.5 GBytes per second data transfer rates possible.

The Dual-Core Intel® Xeon® Processor 5160 offers higher clock frequencies than the Dual-Core Intel® Xeon® Processor 5100 Series for platforms that are targeted for the performance optimized segment.

 

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  • Dual-Core Intel® Xeon® Processor 5100 Series – Intel 64-bit microprocessor intended for dual processor servers and workstations.
  • The Dual-Core Intel® Xeon® Processor 5100 Series are based on Intel’s 65 nanometer process, in the FC-LGA6 package with two processor cores.
  • For this document, “processor” is used as the generic term for the Dual-Core Intel® Xeon® Processor 5100 Series.
    • Dual-Core Intel® Xeon® Processor LV 5148, Dual-Core Intel® Xeon® Processor LV 5138 and Dual-Core Intel® Xeon® Processor LV 5128- Intel 64-bit microprocessor intended for dual processor server blades and embedded servers requiring higher case temperatures.
  • The Dual-Core Intel® Xeon® Processor LV 5148, Dual-Core Intel® Xeon® Processor LV 5138, and Dual-Core Intel® Xeon® Processor LV 5128 are lower voltage, lower power version of the Dual-Core Intel® Xeon® Processor 5100 Series.
  • For this document “Dual-Core Intel® Xeon® Processor LV 5148/5138/5128” is used to call out specifications that are unique to the Dual-Core Intel® Xeon® Processor LV 5148/5138/5128 SKU.
    • Dual-Core Intel® Xeon® Processor 5160- A performance optimized version of the Dual-Core Intel® Xeon® Processor 5100 Series.
  • For this document “Dual-Core Intel® Xeon® Processor 5160” is used to call out specifications that are unique to the Dual-Core Intel® Xeon® Processor 5160 SKU.
    • FC-LGA6 (Flip Chip Land Grid Array) Package – The Dual-Core Intel® Xeon® Processor 5100 Series package is a Land Grid Array, consisting of a processor core mounted on a pinless substrate with 771 lands, and includes an integrated heat spreader (IHS).
    • LGA771 socket – The Dual-Core Intel® Xeon® Processor 5100 Series interfaces to the baseboard through this surface mount, 771 Land socket. See the LGA771 Socket Design Guidelines for details regarding this socket.
    • Processor core – Processor core with integrated L1 cache. L2 cache and system bus interface are shared between the two cores on the die. All AC timing and signal integrity specifications are at the pads of the processor core.
    • FSB (Front Side Bus) – The electrical interface that connects the processor to the chipset.
  • Also referred to as the processor system bus or the system bus.
  • All memory and I/O transactions as well as interrupt messages pass between the processor and chipset over the FSB.
    • Dual Independent Bus (DIB) – A front side bus architecture with one processor on each bus, rather than a FSB shared between two processor agents.
  • The DIB architecture provides improved performance by allowing increased FSB speeds and bandwidth.
    • Flexible Motherboard Guidelines (FMB) – Are estimates of the maximum  values the Dual-Core Intel® Xeon® Processor 5100 Series will have over certain time periods.
  • The values are only estimates and actual specifications for future
    processors may differ.
    • Functional Operation – Refers to the normal operating conditions in which all processor specifications, including DC, AC, FSB, signal quality, mechanical and thermal are satisfied.
    • Storage Conditions – Refers to a non-operational state.
  • The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
  • Under these conditions, processor lands should not be connected to any supply voltages, have any I/Os biased or receive any clocks.
  • Upon exposure to “free air” (that is, unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material.

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